2020, 7(3): 776-789.
doi: 10.1109/JAS.2020.1003150
Abstract:
Accompanying the unceasing progress of integrated circuit manufacturing technology, the mainstream production mode of current semiconductor wafer fabrication is featured with multi-variety, small batch, and individual customization, which poses a huge challenge to the scheduling of cluster tools wit...
Jipeng Wang, Hesuan Hu, Chunrong Pan, Yuan Zhou and Liang Li, "Scheduling Dual-Arm Cluster Tools With Multiple Wafer Types and Residency Time Constraints," IEEE/CAA J. Autom. Sinica, vol. 7, no. 3, pp. 776-789, May 2020. doi: 10.1109/JAS.2020.1003150.